电子灌封胶 - Electronic Potting Compounds

电子灌封胶是一种专为电子元器件保护设计的高性能材料，通常以环氧树脂、有机硅或聚氨酯为基材，能够在固化后形成致密的保护层。它具有优异的耐高低温、耐湿热、耐化学腐蚀和电绝缘性能，有效防止外界环境对电子元器件的损害，同时提高其可靠性和使用寿命。电子灌封胶广泛应用于电路板、传感器、变压器和LED灯具等领域，常见类型包括硬性灌封胶和柔性灌封胶，前者用于结构加固，后者适合需要抗震或热膨胀的场景。

Electronic potting compound is a high-performance material specifically designed to protect electronic components. Typically based on epoxy resin, silicone, or polyurethane, it cures to form a dense protective layer. This compound offers excellent resistance to high and low temperatures, humidity, chemical corrosion, and electrical insulation, effectively shielding electronic components from environmental damage while enhancing their reliability and service life. Widely used in circuit boards, sensors, transformers, and LED lighting, electronic potting compounds come in two main types: rigid potting compounds for structural reinforcement and flexible ones for applications requiring shock resistance or thermal expansion accommodation.

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